Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
UNIKO Synthetic resin tile adopts Europe advanced coextrusion technology, using ASA high weather resistant
engineering plastic and PVC (polyvinyl chloride resin) as
main material, mixing anti-UV agent, shielding agent, antioxidant, modifier and othe
We supply high quality steel with great elastic region and tensile strength. Grade HP295/SG295 steel has excellent impact and welding properties, is used for manufacturing LPG and other gas cylinders.
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Payment Account：44044301040010464
Bank Name：中国农业银行广州房建支行
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Price difference upgrade: Monthly payment package+7 days free, annual payment package+15 days free
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